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Re: gEDA-dev: Blind and buried vias in PCB... who is doing what?

On Tue, 18 Jul 2006 04:10:40 -0700
ldoolitt@recycle.lbl.gov wrote:

> I would also like to remind people in this context that there
> is a request for four states of joining (or not) of a via to
> the polygon (if any) per layer:
>   0: no connect
>   1: traditional X thermal
>   2: alternate + thermal
>   3: solid connection

I think there should be a 5th, which is "auto", when the logic would select trace(s) from x and +, that does not short anything.

Levente

--
http://web.interware.hu/lekovacs

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