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Re: gEDA-user: PCB paste layer, revisited.

As long as we are on this topic.

the solder mask should be part of the pad stack.

I have some parts/and designs that requite unmasked via's and  
shapes.  spark gap for extreme over voltage in power supplies.

Not having a true solder mask layer in pcb is a limitation.

overall i see this thread as a request to add non-copper layers to  
footprints.

we could start sneaking in a keep out layer. :-)



On Oct 15, 2007, at 3:07 PM, Dave N6NZ wrote:

>
>
> DJ Delorie wrote:
>>> Imagine, that you have a 431 pin BGA. Would you include 431 times
>>> the same padstack in the footprint? I think one should bother with
>>> the whatever shape, and size of the stencil, copper, mask, paste
>>> layers. Those are just "pads".  Then we could link pads to a
>>> padstack, and the padstacks into the footprint.
>>
>> For sanity's sake, let's let a footprint define its pad stacks for  
>> its
>> own pads, rather than trying to maintain a global cache of padstacks.
>>
>> Then, a BGA footprint would have one "here's what my pads look like"
>> and 431 copies of "put one here".
>
> Yup.  Right answer.
>
> A footprint needs to be entirely self-contained.
>
> -dave
>
>
>
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smime.p7s



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